ISMNM2021

Ms. Yuko Akabane
President, TDC corporation, Japan

TDC is a manufacturing company which is selected as a Global Niche Top company by Japan’s government. We have established a unique, world–class polishing technology in the field of nano-level ultra-precise lapping and polishing. I’d like to introduce the experience of “demand-pull” and “technology push” approach to development.

Doctoral course student of Tohoku Universtity, Kuriyagawa lab.
born in 1975. engaged in the development of precision lapping and polishing technology as president of TDC corporation. Now working on new research at Kuriyagawa lab, Tohoku univ.

Professor Ming Chen
Professor, Shanghai Jiao Tong University, China

Prof. & Dr. CHEN Ming got Ph.D. from Nanjing University of Aeronautics & Astronautics in 1994. He became the professor of Shanghai Jiao Tong University in 1999. From 1998 to 2007, he worked as senior visiting research scholar of University of Michigan in USA, Kyungpook National University in KOREA, RIKEN and Osaka University in JAPAN.
Prof. CHEN has published over 500 journal papers and 8 books. His major contributions lie in machining theory on difficult-to-cut materials and cutting database, high speed cutting and high efficiency grinding theory and technology, diamond coated tools fabrication and application, micromachining and cutting tool design. He has been the leader of more than 100 projects from government and industries.

Bert Lauwers is a professor of Department of Mechanical Engineering, Dean of Faculty of Engineering Technology of KU Leuven, Belgium, and is vice president of the International Academy for Production Engineering (CIRP). He got his Mater’s degree of Mechanical Engineering in 1987 from KU Leuven, PhD in Mechanical Engineering in 1993 from KU Leuven. He was a lecturer at Asian Institute of Technology (AIT) in 1992, post-doctoral researcher in mechanical engineering in KU Leuven during 1993-1998, and professor from 1998. He was Campus Chair of Campus De Nayer & Campus Geel during 2013-2016. He is Fellow Member CIRP, and Secretary of the CIRP Scientific and Technical Committee on Electro- Physical and Chemical Processes since 2006. He is Member of the Scientific Advisory Board of Sirris, Member of BSMEE (Belgian Society of Mechanical and Environmental Engineers), Member of the KVIV (Royal Flemish Engineering Society), Member of the Dutch Association for Production Technology (VPT), Member of the SME (Society of Manufacturing Engineers), Member of NAMRI (North American Manufacturing Research Institution), and Member of BIN (Belgian Institute for Normalisation). He won SME/CASA LEAD Award, for excellence in teaching and research in integrated manufacturing in 1998. And he won Wendelen Prize (Herk-de-Stad) Awarded to persons living in Herk-de-Stad for their outstanding contributions in the domain of science and culture. He won Yearly MTTRF Loan Award for advanced machine tools (MTTRF = Machine Tool Research Foundation) in 2007.

Invited Speaker

【 from Japan 】

Professor Toshiyuki ENOMOTO Osaka University Title: Hard tissues and soft tissues machining
Professor Hiromi ISOBE Nagaoka University of Technology Title: Visualization of Dynamically Changing Cutting Force under Ultrasonic Cutting Condition
Professor Yasuhiro KAKINUMA Keio University Title: Reaction-induced slurry assisted (RISA) grinding of optical glass lenses
Professor Kazuki KANEKO Ibaraki University Title: Sensor-less tool condition monitoring method in end milling operation using real-time cutting force simulation
Professor Shuhei KODAMA Tokyo University of Agriculture and Technology Title: Nanostructure generation and metal deposition by short-pulsed laser ablation in electrolyte
Professor Masayoshi MIZUTANI Tohoku University Title: Creation and Application of 3D Graded Porous Structures with Metal Additive Manufacturing
Professor Mitsuyoshi NOMURA Akita Prefectural University Title: Polishing Performance of Magnetic Compound Fluid (MCF) Wheel Polishing
Professor Hitoshi OHMORI RIKEN Title: New Desktop Machine with Single-Nano Resolution and its Cutting and Grinding Application
Professor Teppei ONUKI Ibaraki University Title: Crystallographic subsurface damages observations using super-resolution Raman tomographic imaging in advanced semiconductor and ceramics materials
Professor Keita SHIMADA High Energy Accelerator Research Organization Title: Ultrasonic-assisted cutting for fabrication of functional microstructures
Professor Tsunehisa SUZUKI Akita Prefectural University Title: Local Metal Deposition on Low Heat Resistance Resin by Laser Enhanced Electroless Plating
Professor Kyosuke TAGUCHI National Institute of Technology, Hachinohe College Title: Burr suppression mechanism in ultrasonic vibration assisted drilling
Professor Jiwang YAN Keio University Title: Surface structuring on hard brittle materials
Professor Nobuhito YOSHIHARA Iwate University Title: Effect of the abrasive grain distribution on surface roughness

【 from China 】

Professor Huajun CAO Chongqing University Title: Specific Cutting Energy modeling of High-Speed Dry Milling UD-CF/PEEK Based on Energy Distribution Mechanism Effected by Frequently Impact and Size Effect
Professor Jing CHEN Peking University Title: Microfluidic chips by glass molding
Professor Yuanliu CHEN Zhejiang University Title:Cutting force sensing and control for ultra-precision diamond cutting
Professor Jiang GUO Dalian University of Technology Title: Mechanism of high flatness and parallelism generation in double-sided Lapping
Professor Xiuqing HAO Nanjing University of Aeronautics and Astronautics Title: Engineering metallic surfaces with robust super-repellence to low surface tension liquids
Professor Longqiu LI Harbin Institute of Technology Title: Additive Manufacturing of Magnetically Active Micro-grippers
Professor Guanglan LIAO Huazhong University of Science and Technology Title: Preparation and application of super hydrophilic copper hydroxide micro/nanostructure
Professor Yebing TIAN Shandong University of Technology Title: A Novel Magnetic Shear Thickening Finishing Method, Tool, Media and Finishing Characteristics
Professor Yongbo WU Southern University of Science and Technology Title: A Novel Progressive Thinning Process of Si Wafer by Constant-pressure grinding and Ultrasonic-assisted Fixed-abrasive CMP
Professor Lijing XIE Beijing Institute of Technology Title: Experimental and Simulation Study on the Meso-scale cutting of SiCp/Al Composites
Professor Jie XU Harbin Institute of Technology Title: lectrically-assisted micro-forming process of micro-gear in TC4 titanium alloy
Professor Zongwei XU Tianjin University Title: Research on Ultrafast Energetic Beam Nano-and-Atomic Scale Manufacturing of Wide Bandgap Semiconductor Devices
Professor Peng YAO Shandong University Title: Ultra-precision grinding of lens array molds
Prof. Wei YUAN South China University of Technology Title: Manufacturing Functional Structures of Key Components in Fuel Cells and Batteries
Prof. Jun ZHANG Xi’an Jiaotong University Title: Exploration of Microstructure Evolution for Whole Cutting Process
Prof. Lijuan ZHENG Guangdong University of Technology Title: Research on micro deep hole drilling of multicomponent multilayer electronic composites